Journal of Electronic Packaging, Transactions of the ASME Impact Factor in Computer Science
Journal of Electronic Packaging, Transactions of the ASME in Computer Science
Journal Country: United States
Journal Q tier: Q2
Publishing Firm: The American Society of Mechanical Engineers(ASME)
History: 1989-2023
Journal Homepage: Not Available
Journal ISSN: 15289044, 10437398
Research Categories
Electrical and Electronic Engineering (Q2); Mechanics of Materials (Q2); Computer Science Applications (Q3); Electronic, Optical and Magnetic Materials (Q3)
Impact Score: 1.87
h-Index: 58
SJR: 0.44
Ranking: 11566
About Journal of Electronic Packaging, Transactions of the ASME
Aim and ScopePapers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronic, and photonic components, devices, and systems.
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